Wafer diameter/sectional shape measuring machine

Details Wafer diameter/sectional shape measuring machine Wafer diameter/sectional shape measuring machine

1995-01-17

1996-09-10

Pham, Hoa Q.

Optics: measuring and testing

By configuration comparison

With photosensitive film or plate

356386, 25055924, G01N 2186

Patent

active

055550916

ABSTRACT:
The present invention relates to a wafer diameter/sectional shape measuring machine in which the diameter and the sectional shape of the wafer can be measured together. The diameter/sectional shape measuring machine is arranged in the wafer chamfering machine so that the chamfering conditions of the wafer can be adjusted in a short time without taking the wafer out from the wafer chamfering machine. The wafer diameter/ sectional shape measuring machine comprises a position control mechanism. The position control mechanism positions a center and an orientation flat of a wafer on a wafer table. The wafer table, which can rotate and move vertically, adsorbs and holds the wafer. A shape detector detects a sectional shape of the wafer. A measuring mechanism drives the shape detector in the direction of the wafer table and detects a moving value. The moving value is based on the distance that the measuring mechanism moves the shape detector. An image processing mechanism calculates the sectional shape of the wafer from the data detected by the shape detector. A size calculating mechanism calculates the diameter of the wafer in accordance with the signals from the image processing mechanism and the moving value.

REFERENCES:
patent: 4853880 (1989-08-01), Akamatsu et al.
patent: 5175595 (1992-12-01), Fukase
patent: 5194743 (1993-03-01), Aoyama et al.
patent: 5350899 (1994-09-01), Ishikawa et al.

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