Wafer cooling device

Details Wafer cooling device Wafer cooling device

1996-02-16

1998-09-22

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118723E, 118728, 118500, 118666, 20429809, 20429815, 156345, 165 804, 165275, 279128, 361234, C23C 1600, C23C 1450

Patent

active

058109331

ABSTRACT:
A wafer cooling device (WCD) for cooling a substrate, such as a wafer, during processing is presented. The substrate is mounted to an WCD heat transfer surface, thereby forming a cavity in between the substrate and the heat transfer surface into which gas is incorporated. An array of protuberances within the cavity provide support for the wafer. Contact heat conduction between the substrate and WCD is reduced by reducing the amount of direct contact between the substrate and WCD. Thus the heat transfer coefficient from the substrate, and hence substrate temperature, is controlled by adjusting the gas pressure in the cavity. In alternative embodiments, gas distribution channels are formed in the WCD heat transfer surface to increase gas pressure uniformity between the wafer and the WCD thus improving temperature uniformity across the substrate.

REFERENCES:
patent: 4184188 (1980-01-01), Briglia
patent: 4384918 (1983-05-01), Abe
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4508161 (1985-04-01), Holden
patent: 4680061 (1987-07-01), Lamont, Jr.
patent: 4743570 (1988-05-01), Lamont, Jr.
patent: 4771730 (1988-09-01), Tezuka
patent: 4909314 (1990-03-01), Lamont, Jr.
patent: 5155652 (1992-10-01), Logan et al.
patent: 5160152 (1992-11-01), Toraguchi et al.
patent: 5203958 (1993-04-01), Arai et al.
patent: 5213349 (1993-05-01), Elliott
patent: 5223113 (1993-06-01), Kaneko et al.
patent: 5255153 (1993-10-01), Nozawa et al.
patent: 5267607 (1993-12-01), Wada
patent: 5320982 (1994-06-01), Tsubone et al.
patent: 5345999 (1994-09-01), Hosokawa
patent: 5346578 (1994-09-01), Benzing et al.
patent: 5366002 (1994-11-01), Tepman
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5460684 (1995-10-01), Saeki et al.
patent: 5474614 (1995-12-01), Robbins
patent: 5478429 (1995-12-01), Komino et al.
patent: 5484011 (1996-01-01), Tepman et al.
patent: 5517753 (1996-05-01), Messina
patent: 5528451 (1996-06-01), Su
patent: 5530616 (1996-06-01), Kitabayashi et al.
patent: 5531835 (1996-07-01), Fodor et al.
patent: 5539179 (1996-07-01), Nozawa et al.
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5572398 (1996-11-01), Federlin et al.
patent: 5581874 (1996-12-01), Aoki et al.
patent: 5583736 (1996-12-01), Anderson et al.
patent: 5665166 (1997-09-01), Deguchi et al.
patent: 5675471 (1997-10-01), Kotecki
Cooper, M. et al., "Thermal Contact Conductance", Int. J. Heat Mass Transfer 12:279-300 (1969).
Hasper, A. et al., "Heat transport in cold-wall single-wafer low pressure chemical-vapor-deposition reactors", J. Vac. Sci. Technol. A 10:3193-3202 (1992).
Wright, D. et al., "Low temperature etch chuck: Modeling and experimental results of heat transfer and water temperature", J. Vac. Sci. Technol. A 10:1065-1070 (1992).

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