Wafer cleaning system

Details Wafer cleaning system Wafer cleaning system

2005-01-18

2005-01-18

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S032000, C134S034000, C134S137000, C134S140000, C134S184000, C134S187000, C134S188000, C134S198000, C134S902000, C438S906000

Reexamination Certificate

active

06843257

ABSTRACT:
Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

REFERENCES:
patent: 4401131 (1983-08-01), Lawson
patent: 6039059 (2000-03-01), Bran
patent: 6679272 (2004-01-01), Bran et al.

Affiliated with

Also associated with

Rating

Wafer cleaning system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer cleaning system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer cleaning system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3427388