Wafer cleaning apparatus with multiple wash-heads

Details Wafer cleaning apparatus with multiple wash-heads Wafer cleaning apparatus with multiple wash-heads

2007-08-07

2007-08-07

Barr, Michael (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S181000, C134S094100, C134S148000, C134S153000, C134S198000, C134S902000, C015S077000, C015S102000, C015S088200

Reexamination Certificate

active

10655224

ABSTRACT:
A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

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