Wafer clamping method

Details Wafer clamping method Wafer clamping method

1992-07-30

1993-12-07

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 118728, 118729, 118500, 269296, 269303, H01L 2100

Patent

active

052680673

ABSTRACT:
In one embodiment this is a method of clamping semiconductor wafers for processing with the active face down. The method comprises: supporting a face down wafer 10 on an intermediate support 15; placing a clamping surface 14 at least adjacent to a backside of the wafer; moving at least three bevel-edged pins 11 upward to engage the beveled edges 12 with portions of the periphery of the face to press the wafer 10 against the clamping surface 14; moving the intermediate support 15 away from the wafer 10, and removing photoresist from the wafer by ashing the photoresist, whereby photoresist is essentially completely removed and essentially no unremoved photoresist remains to contaminate later processing.

REFERENCES:
patent: 4872938 (1989-10-01), Davis

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