Wafer bonding hermetic encapsulation

Details Wafer bonding hermetic encapsulation Wafer bonding hermetic encapsulation

2004-08-09

2009-11-24

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S127000, C438S455000, C257SE21499

Reexamination Certificate

active

07622324

ABSTRACT:
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device.

REFERENCES:
patent: 5389569 (1995-02-01), Cambou et al.
patent: 5501003 (1996-03-01), Bernstein
patent: 5516727 (1996-05-01), Broom
patent: 5610431 (1997-03-01), Martin
patent: 5821692 (1998-10-01), Rogers et al.
patent: 5866942 (1999-02-01), Suzuki et al.
patent: 6071761 (2000-06-01), Jacobs
patent: 6146917 (2000-11-01), Zhang et al.
patent: 6232150 (2001-05-01), Lin et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6624003 (2003-09-01), Rice
patent: 6627814 (2003-09-01), Stark
patent: 6660564 (2003-12-01), Brady
patent: WO 01/61743 (2001-08-01), None

Affiliated with

Also associated with

Rating

Wafer bonding hermetic encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer bonding hermetic encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer bonding hermetic encapsulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4118788