4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Portion of housing of specific materials

Robert Markunas

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Wafer bonding hermetic encapsulation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Wafer bonding hermetic encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2772809

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