Wafer backside plate for use in a spin, rinse, and dry...

Details Wafer backside plate for use in a spin, rinse, and dry... Wafer backside plate for use in a spin, rinse, and dry...

2006-08-08

2006-08-08

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

With work or work parts movable during treatment

C134S032000, C156S345230, C156S345540, C156S345550

Reexamination Certificate

active

07087122

ABSTRACT:
A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as spinning of the wafer proceeds to an optimum spinning speed. The second position defines a reduced gap between an under surface of the wafer and a top surface of the wafer backside plate. The method also includes repositioning the wafer backside plate from the second position to the first position as the spinning reduces in speed. The first position defines an enlarged gap to enable loading and unloading of the wafer from the engaged position.

REFERENCES:
patent: 4313266 (1982-02-01), Tam
patent: 4651440 (1987-03-01), Karl
patent: 4788994 (1988-12-01), Shinbara
patent: 5472502 (1995-12-01), Batchelder
patent: 6497241 (2002-12-01), Pascal
patent: 6578853 (2003-06-01), Treur et al.
patent: 6616772 (2003-09-01), de Larios et al.

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