Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-12-20
2010-10-12
Mehta, Bhavesh M (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S218000, C348S087000, C348S095000, C414S936000
Reexamination Certificate
active
07813542
ABSTRACT:
Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.
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Bae Do-In
Kim Sang-Ho
Lee Heok-Jae
Park Hyu-Rim
Seo Kee-Weone
Mehta Bhavesh M
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
Yuan Kathleen S
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