Vertical transistor and memory cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257296, 257329, 257 71, H01L 27108, H01L 2976

Patent

active

060181761

ABSTRACT:
A method for manufacturing a three-dimensionally structured vertical transistor or memory cell forms a silicon-on-insulator (SOI) structure on a semiconductor substrate and sequentially deposits a drain region, a channel region and a source region on the SOI substrate structure. The transistor includes a cylinder-type gate insulation layer surrounding the channel region and a gate electrode surrounding the gate insulation layer, having increased integration. This process and structure avoid the characteristic degradation caused by the leakage current associated with the trench process and structure.

REFERENCES:
patent: 5561308 (1996-10-01), Kamata et al.

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