Vertical low pressure CVD apparatus with an adjustable nozzle

Details Vertical low pressure CVD apparatus with an adjustable nozzle Vertical low pressure CVD apparatus with an adjustable nozzle

1994-11-04

1996-04-02

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118725, C23C 1600

Patent

active

055036783

ABSTRACT:
A vertical low pressure CVD (Chemical Vapor Deposition) apparatus includes a first and a second annular nozzle assigned to silane gas and an oxidizing gas, respectively. The first nozzle adjoins the lowermost portion of a boat loaded with a stack of wafers. The two nozzles are spaced from each other and have a plurality of holes arranged in a similar fashion. The oxidizing gas, jetted from the second nozzle, reaches the first nozzle over the same distance and, therefore, in the same amount as measured around the first nozzle. As a result, the two kinds of gas are mixed in a uniform ratio. The distance between the two nozzles may be changed for different types of oxidizing gases to uniformly mix the oxidizing gas with the silane gas without an early reaction.

REFERENCES:
patent: 4817558 (1989-04-01), Itoh
patent: 5029554 (1991-07-01), Miyashita
patent: 5127365 (1992-07-01), Koyama
patent: 5320680 (1994-06-01), Learn

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