Varying capacitance voltage contrast structures to determine...

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S014000

Reexamination Certificate

active

07927895

ABSTRACT:
A method for determining resistances of defects in a test structure, comprising: forming a first layer of the test structure having elements under test; generating a first e-beam image of the first layer, the first e-beam image graphically identifying defects detected at the first layer, each defect at the first layer having a corresponding grey scale level; adding capacitance to the structure by forming a metal layer of the structure; generating a second e-beam image of the metal layer, the second e-beam image graphically identifying defects detected at the metal layer, each defect at the metal layer having a corresponding grey scale level; generating a pattern of grey scale levels for each defect based on the corresponding grey scale level of each defect at each layer of the test structure; and determining a resistive range of each defect based on the pattern of grey scale levels generated for each defect.

REFERENCES:
patent: 5189306 (1993-02-01), Frei
patent: 6297644 (2001-10-01), Jarvis et al.
patent: 6509197 (2003-01-01), Satya et al.
patent: 6861666 (2005-03-01), Weiner et al.
patent: 6921672 (2005-07-01), Satya et al.
patent: 7026175 (2006-04-01), Li et al.
patent: 2006/0192904 (2006-08-01), Almogy et al.
patent: 2008/0032429 (2008-02-01), Chen et al.
patent: 2009/0057644 (2009-03-01), Shin et al.
patent: 2009/0096461 (2009-04-01), Ahsan et al.
patent: 2010/0279436 (2010-11-01), Fu et al.
J.C. Lee, C.H. Chen, D. Su, J.H. Chuang, “Investigation of Sensitivity Improvement on Passive Voltage Contrast for Defect Isolation”, Microelectronics Reliability, vol. 42, No. 9-11, pp. 1707-1710, 2002.
M. Matsui, T. Odaka, H. Nagaishi, K. Sakurai, “Quantitative Measurement of Voltage contrast in SEM Images for In-Line Resistance Inspection of Wafers Manufactured for SRAM”, Proceedings of the SPIE-The International Society for Optical Engineering, vol. 7272, pp. 72721D (8 pages), 2009.
M. Matsui, Y. Anan, T. Odaka, H. Nagaishi, K. Sakurai, “In Line Inspection Resistance Mapping Using Quantitative Measurement of Voltage Contrast in SEM Images”, Proceedings of the SPIE-The International Society for Optical Engineering, vol. 6922, pp. 692218-1-692218-8, 2008.
M. Matsui, Z. Cheng, M. Nozoe, K. Torli, “Detecting Defects in Cu Metallization Structures by Electron-Beam Wafer Inspection”, Journal of the Eletrochemical Society, vol. 151, No. 6, pp. G440-2, 2004.
O.D. Patterson, H. Wildman, D. Gal, K. Wu, “Detection of Resistive Shorts and Opens Using Voltage Contrast Inspection”, Micro, vol. 24, No. 5, pp. 67-68, 2006.
T. Sakai, N. Oda, T. Yokoyama, H. Kikuchi, H. Kitajima, “Defect Isolation and Characterization in Contrast Array/Chain Structures by Using Voltage Contrast Effect”, Conference Proceedings of IEEE International Symposium on Semiconductor Manufacturing Conference, Santa Clara, CA, Oct. 11-13, 1999., pp. 195-198.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Varying capacitance voltage contrast structures to determine... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Varying capacitance voltage contrast structures to determine..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Varying capacitance voltage contrast structures to determine... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2639667

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.