Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2006-11-03
2008-11-25
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S197000, C438S283000, C438S595000, C257SE21051, C257SE21457, C257SE21626
Reexamination Certificate
active
07456066
ABSTRACT:
MOSFET gate structures comprising multiple width offset spacers are provided. A first and a second gate structure are formed on a semiconductor substrate. A pair of first offset spacers are formed adjacent either side of the first gate structure. Each of the first offset spacers comprises a first silicon oxide layer with a first dielectric layer overlying. A pair of second offset spacers are formed adjacent either side of the second gate structure. Each of the second offset spacers comprises a second silicon oxide layer with a second dielectric layer overlying. Ion implanted doped regions are formed in the semiconductor substrate adjacent the first and second offset spacers respectively to form a first and second MOSFET device. A maximum width of each of the first offset spacers is different from that of the second offset spacers. The first silicon oxide layer is thinner than the second silicon oxide layer.
REFERENCES:
patent: 5021354 (1991-06-01), Pfiester
patent: 2007/0114605 (2007-05-01), Dyer et al.
Birch & Stewart Kolasch & Birch, LLP
Lee Cheung
Lindsay, Jr. Walter L
Taiwan Semiconductor Manufacturing Co. Ltd.
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