Variable volume plasma processing chamber and associated...

Details Variable volume plasma processing chamber and associated... Variable volume plasma processing chamber and associated...

2007-05-18

2010-11-02

Hassanzadeh, Parviz (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

C118S7230AN

Reexamination Certificate

active

07824519

ABSTRACT:
A plasma processing chamber includes a substrate support having a top surface defined to support a substrate in a substantially horizontal orientation within the chamber. The plasma processing chamber also includes a number of telescopic members disposed within the chamber outside a periphery of the substrate support. The number of telescopic members are also disposed in a concentric manner with regard to a center of the top surface of the substrate support. Each of the number of telescopic members is defined to be independently moved in a substantially vertical direction so as to enable adjustment of an open volume above the top surface of the substrate support, and thereby enable adjustment of a plasma condition within the open volume above the top surface of the substrate support.

REFERENCES:
patent: 6350317 (2002-02-01), Hao et al.
patent: 6433484 (2002-08-01), Hao et al.
patent: 6984288 (2006-01-01), Dhindsa et al.
patent: 7156047 (2007-01-01), Kang et al.
patent: 7578258 (2009-08-01), Fischer
patent: 2006/0011138 (2006-01-01), Kang et al.
patent: 2006/0278340 (2006-12-01), Fischer

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