Variable circuit connector and method of fabricating the same

Details Variable circuit connector and method of fabricating the same Variable circuit connector and method of fabricating the same

1999-03-22

2000-09-26

Elms, Richard

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438128, 438514, H01L 214763

Patent

active

061241962

ABSTRACT:
Method for forming a variable circuit connector in a wafer having a plurality of circuit modules, is disclosed, which allows selective cut-off and connection between circuit modules, including the steps of forming an insulating layer on an entire surface of the wafer inclusive of a plurality of connecting layers connected to terminals on the circuit modules, and injecting conductive ions into the insulating layer between the connecting layers intended to connect to each other.

REFERENCES:
patent: 3915755 (1975-10-01), Goetzberger et al.
patent: 4233671 (1980-11-01), Gerzberg et al.
patent: 4373165 (1983-02-01), Tasch, Jr.
patent: 5354704 (1994-10-01), Yang et al.
J. Otterstedt et al., Session 7: Reconfiguration-B, 1994 International Conference on Wafer Scale Integration pp. 315-323.
Laser Repair of Faulty Packaged VLSI Chips, Electronics Letters Nov. 1988 vol. 24 No. 24 pp. 1474-1475.

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