Vapor treatment process for reducing oxide depletion

Details Vapor treatment process for reducing oxide depletion Vapor treatment process for reducing oxide depletion

1998-07-30

2000-02-15

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 13, 134 18, 134 29, 134 32, 134 34, 134902, 134 12, B08B 600, B08B 704, B08B 300, B08B 102

Patent

active

060248025

ABSTRACT:
A vapor processing method for reducing oxide material depletion includes an early step of placing a polymer-coated substrate inside a vapor process chamber (VPC), a pre-processing step of passing an inert gas into the VPC for a definite period followed by an idling period, a clearing step of passing a reactive gas carried by an inert carrier into the VPC for clearing away previously deposited polymer on the substrate, and a post-processing step of passing an inert gas into the VPC to purge any unreacted reactive gases. Thereafter, the substrate is transferred to a dry task chamber (DTC) for cleaning, wherein the cleaning includes removing any residual gases on the wafer surface. Time required for cleaning the wafer in the DTC is smaller than the total time required for pre-processing, polymer clearing and post-processing.

REFERENCES:
patent: 5693148 (1997-12-01), Simmons et al.

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