Semiconductor device manufacturing: process – Gettering of substrate – By vapor phase surface reaction
Reexamination Certificate
2007-12-04
2007-12-04
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Gettering of substrate
By vapor phase surface reaction
Reexamination Certificate
active
10818821
ABSTRACT:
In a vapor-phase growth method in which a silicon-germanium mixed crystal layer is deposited on a semiconductor substrate, the vapor-phase growth method comprises a first step of introducing silicon raw material gas into a reaction furnace in such a manner that a silicon raw material gas partial pressure increases in proportion to a time to thereby deposit a first semiconductor layer of a silicon layer on the semiconductor substrate under reduced pressure, a second step of introducing silicon raw material gas and germanium raw material gas into the reaction furnace in such a manner that a desired germanium concentration may be obtained to thereby deposit a second semiconductor layer of a silicon-germanium mixed crystal layer on the first semiconductor layer under reduced pressure and a third step of introducing silicon raw material gas into the reaction furnace under reduced pressure to thereby deposit a third semiconductor layer of a silicon layer on the second semiconductor layer. Thus, there can be obtained a semiconductor layer in which a misfit dislocation can be improved.
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Atsuumi Kenji
Hirata Tatsushiro
Koumoto Takeyoshi
Negoro Yoichi
Noguchi Takashi
Harrison Monica D.
Jr. Carl Whitehead
Sonnenschein Nath & Rosenthal LLP
Sony Corporation
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