Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-10-19
1995-01-10
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118728, 156634, 156644, 156656, 156657, B44C 122, C23F 100, C23C 1600
Patent
active
053803965
ABSTRACT:
Disclosed is a gas valve capable of switching gases to be introduced within a vacuum chamber with high speed thereby enhancing the controllability of the composion of a semiconducting thin film growing on a substrate and shortening the time required for growth of the thin film. The gas valve comprises a bendable film between a pair of parallel plate electrodes whereby operating the film by an electrostatic force and opening and closing a port for releasing gas to a substrate mounted on the wall surface of a gas chamber and a port for exhausting an unnecessary gas to an exhaust passage. The gas valve is mounted in the vicinity of the substrate within the vacuum chamber for supplying a working gas in a minimum amount required for the film growth.
REFERENCES:
patent: 2901623 (1959-08-01), Wouters
patent: 3981480 (1976-09-01), Eevnisse
patent: 4474212 (1984-10-01), Schmitz
patent: 4530317 (1985-07-01), Schutten
patent: 4581624 (1986-04-01), O'Connor
patent: 4610426 (1986-09-01), Brandner
patent: 4617952 (1986-10-01), Fujiwara et al.
patent: 4647013 (1987-03-01), Giachino et al.
patent: 4756508 (1988-07-01), Giachino et al.
patent: 4934401 (1990-06-01), Ikehata et al.
patent: 5029805 (1991-07-01), Albarda et al.
patent: 5069419 (1991-12-01), Jerman
patent: 5082242 (1992-01-01), Bonne et al.
patent: 5244537 (1993-09-01), Ohnstein
Horiuchi Yasuaki
Kawamura Yoshio
Koide Akira
Miyada Toshimitsu
Sato Kazuo
Hitachi , Ltd.
Powell William
LandOfFree
Valve and semiconductor fabricating equipment using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Valve and semiconductor fabricating equipment using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Valve and semiconductor fabricating equipment using the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-848670