Using an organic layer as an ion implantation mask when forming

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438297, 438514, 438780, H01L 21336

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active

061658561

ABSTRACT:
The invention pertains to semiconductor processing methods of implanting dopants into semiconductor substrates. In one aspect, the invention includes, a semiconductor processing method comprising: a) forming an organic layer over a semiconductive substrate; and b) implanting a conductivity-enhancing dopant through the organic layer and into the semiconductive substrate. In another aspect, the invention includes a semiconductor processing method comprising: a) providing a semiconductive substrate and defining source and drain locations within so the semiconductive substrate; b) forming an organic layer over the source and drain locations; c) implanting a conductivity-enhancing dopant through the organic layer and into the source and drain locations to form source and drain implant regions within the source and drain locations, respectively; and d) forming a transistor gate proximate the source and drain implant regions. In another aspect, the invention includes a semiconductor processing method comprising: a) forming a transistor gate over a semiconductive substrate and defining source/drain locations within the semiconductive substrate proximate the transistor gate; b) forming a polyimide layer over the transistor gate and over the source/drain locations; c) depositing photoresist over the polyimide layer; d) patterning the photoresist to form openings over the source/drain locations; and e) implanting a conductivity-enhancing dopant into the openings, through the polyimide layer and into the source/drain locations.

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