Use of immersion tin coating as etch resist

Details Use of immersion tin coating as etch resist Use of immersion tin coating as etch resist

1985-12-13

1987-04-14

Hayes, Lorenzo B.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156664, 156901, 156904, 427 96, 4271261, 427309, 427437, B44C 122

Patent

active

046576320

ABSTRACT:
A process is disclosed for manufacturing a circuit board having a metal layer in which a portion of the metal layer is removed by etching. A novel etch resist immersion tin composition is selectively applied to the metal layer to leave areas of coated and uncoated metal followed by etching the metal not coated with the resist. The immersion tin composition is applied as a substantially pore free coating at thicknesses of from about 0.08 to about 0.175 microns. The novel immersion tin composition contains a tin salt and both thiourea compounds and urea compounds.

REFERENCES:
patent: 3303029 (1967-02-01), Shipley
patent: 4574031 (1986-03-01), Dorey et al.
patent: 4588474 (1986-05-01), Gross
Derwent Publication, Acc. No. 80-67141C/38, Russian Pat. No. 712-455, Jan. 30, 1980.

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