Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-05-23
2010-12-07
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S110000, C438S127000, C438S613000, C438S617000, C438S464000, C257SE23010, C257SE23033
Reexamination Certificate
active
07846775
ABSTRACT:
Techniques for forming micro-array style packages are disclosed. A matrix of isolated contact posts are placed on an adhesive carrier. Dice are then mounted (directly or indirectly) on the carrier and each die is electrically connected to a plurality of associated contacts. The dice and portions of the contacts are then encapsulated in a manner that leaves at least bottom portions of the contacts exposed to facilitate electrical connection to external devices. The encapsulant serves to hold the contacts in place after the carrier has been removed.
REFERENCES:
patent: 5075760 (1991-12-01), Nakashima et al.
patent: 5585195 (1996-12-01), Shimada
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 5719440 (1998-02-01), Moden
patent: 5759874 (1998-06-01), Okawa
patent: 5830800 (1998-11-01), Lin
patent: 5847458 (1998-12-01), Nakamura et al.
patent: 5866948 (1999-02-01), Murakami et al.
patent: 5895234 (1999-04-01), Taniguchi et al.
patent: 5923080 (1999-07-01), Chun
patent: 5998875 (1999-12-01), Bodo et al.
patent: 6034422 (2000-03-01), Horita et al.
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6130473 (2000-10-01), Mostafazadeh et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6177288 (2001-01-01), Takiar
patent: 6238952 (2001-05-01), Lin
patent: 6247229 (2001-06-01), Glenn
patent: 6255740 (2001-07-01), Tsuji et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6261864 (2001-07-01), Jung et al.
patent: 6306684 (2001-10-01), Richardson et al.
patent: 6306685 (2001-10-01), Liu et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6316837 (2001-11-01), Song
patent: 6333252 (2001-12-01), Jung et al.
patent: 6342730 (2002-01-01), Jung et al.
patent: 6355507 (2002-03-01), Fanworth
patent: 6358778 (2002-03-01), Shinohara
patent: 6372539 (2002-04-01), Bayan et al.
patent: 6451627 (2002-09-01), Coffman
patent: 6486004 (2002-11-01), Wensel
patent: 6551859 (2003-04-01), Lee et al.
patent: 6566168 (2003-05-01), Gang
patent: 6683368 (2004-01-01), Mostafazadeh
patent: 6689412 (2004-02-01), Bourrieres
patent: 6689640 (2004-02-01), Mostafazadeh
patent: 6706558 (2004-03-01), Nakamura
patent: 6740961 (2004-05-01), Mostafazadeh
patent: 6762511 (2004-07-01), Satsu et al.
patent: 6812552 (2004-11-01), Islam et al.
patent: 6967125 (2005-11-01), Fee et al.
patent: 6975022 (2005-12-01), Sakamoto et al.
patent: 6975038 (2005-12-01), Mostafazadeh
patent: 7001798 (2006-02-01), Yamaguchi
patent: 7095096 (2006-08-01), Mostafazadeh
patent: 7211467 (2007-05-01), Park et al
patent: 7491625 (2009-02-01), Bayan et al.
patent: 7598122 (2009-10-01), Bayan et al.
patent: 7642175 (2010-01-01), Patwardhan et al.
patent: 2002/0031868 (2002-03-01), Capote et al.
patent: 2002/0192936 (2002-12-01), Ball
patent: 2003/0045032 (2003-03-01), Abe
patent: 2004/0070084 (2004-04-01), Kuramoto et al.
patent: 2004/0171191 (2004-09-01), Connell et al.
patent: 2005/0068757 (2005-03-01), Jayaraman et al.
patent: 2006/0103019 (2006-05-01), Hodson
patent: 2006/0234421 (2006-10-01), Lo et al.
patent: 2007/0273011 (2007-11-01), Singleton et al.
patent: 2008/0079127 (2008-04-01), Gerber
U.S. Appl. No. 10/625,917, filed Jul. 23, 2003.
U.S. Appl. No. 10/919,592, filed Aug. 16, 2004.
Lee Shaw Wei
Patil Sadanand R.
Tu Nghia Thuc
Beyer Law Group LLP
Landau Matthew C
National Semiconductor Corporation
Nicely Joseph C.
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