Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Apparatus to decouple core circuits power supply from input-outp
Design of a two interconnect IC chip for a radio frequency...
Electrical die contact structure and fabrication method
Electrical die contact structure and fabrication method
Leadless package
No associations
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Profile ID: LFUS-PAI-P-1924608