Uniformity control for low flow process and chamber to...

Coating apparatus – Gas or vapor deposition

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S345330, C156S345340

Reexamination Certificate

active

07622005

ABSTRACT:
Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate with sufficient pressure drop to more evenly distribute the gases prior to passing through the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.

REFERENCES:
patent: 5360144 (1994-11-01), Slade
patent: 5532190 (1996-07-01), Goodyear et al.
patent: 5725675 (1998-03-01), Fong et al.
patent: 5741363 (1998-04-01), Van Buskirk et al.
patent: 5844195 (1998-12-01), Fairbairn et al.
patent: 5871586 (1999-02-01), Crawley et al.
patent: 5950925 (1999-09-01), Fukunaga et al.
patent: 5968276 (1999-10-01), Lei et al.
patent: 5976261 (1999-11-01), Moslehi et al.
patent: 6029602 (2000-02-01), Bhatnagar
patent: 6079356 (2000-06-01), Umotoy et al.
patent: 6132512 (2000-10-01), Horie et al.
patent: 6152070 (2000-11-01), Fairbairn et al.
patent: 6190732 (2001-02-01), Omstead et al.
patent: 6245192 (2001-06-01), Dhindsa et al.
patent: 6274495 (2001-08-01), Omstead et al.
patent: 6291341 (2001-09-01), Sharan et al.
patent: 6302964 (2001-10-01), Umotoy et al.
patent: 6364949 (2002-04-01), Or et al.
patent: 6364954 (2002-04-01), Umotoy et al.
patent: 6387182 (2002-05-01), Horie et al.
patent: 6444039 (2002-09-01), Nguyen
patent: 6454860 (2002-09-01), Metzner et al.
patent: 6478872 (2002-11-01), Chae et al.
patent: 6495233 (2002-12-01), Shmurun et al.
patent: 6499425 (2002-12-01), Sandhu et al.
patent: 6502530 (2003-01-01), Turlot et al.
patent: 6508197 (2003-01-01), Omstead et al.
patent: 6645884 (2003-11-01), Yang et al.
patent: 6692575 (2004-02-01), Omstead et al.
patent: 6902629 (2005-06-01), Zheng et al.
patent: 2001/0054381 (2001-12-01), Umotoy et al.
patent: 2002/0017243 (2002-02-01), Pyo
patent: 2002/0092471 (2002-07-01), Kang et al.
patent: 2003/0017268 (2003-01-01), Hu et al.
patent: 2003/0192568 (2003-10-01), Zheng et al.
patent: 2003/0198754 (2003-10-01), Xi et al.
patent: 2004/0052969 (2004-03-01), Lee et al.
patent: 2004/0144490 (2004-07-01), Zhao et al.
patent: 2004/0216844 (2004-11-01), Janakiraman et al.
patent: 2005/0263072 (2005-12-01), Balasubramanian et al.
patent: 0821084 (1998-01-01), None
patent: 0843339 (1998-05-01), None
patent: 61005515 (1986-01-01), None
patent: 05152208 (1993-06-01), None
patent: 527435 (2003-04-01), None
patent: 539761 (2003-07-01), None
patent: 583335 (2004-04-01), None
patent: WO-9966101 (1999-12-01), None
patent: WO-0104376 (2001-01-01), None
patent: WO-0116396 (2001-03-01), None
patent: WO-03065424 (2003-08-01), None
Taiwan IPO Notice of Allowance and Search Report dated Apr. 25, 2008, Taiwan Patent Application No. 94116785.
PCT International Search Report and Written Opinion dated Dec. 24, 2008 for International Application No. PCT/US2008/79272.
Office Action dated Sep. 13, 2007, for U.S. Appl. No. 11/131,010.
Final Office Action dated Feb. 26, 2008, for U.S. Appl. No. 11/131,010.
Tiemessen, M. et al., “Fluorine induced formation of intermetal dielectric effects”,Advanced Semiconductor Manufacturing Conference and Workshop, 1996, ASMC 96 Proceedings, IEEE/SEMI 1996 Cambridge, MA, USA Nov. 12-14, 1996, New York, NY, USA, IEEE, US, Nov. 12, 1996 pp. 303-307, XP010204545, IBSN: 0-7803-3371-3, “Equipment Commonality”, p. 305.
PCT International Search Report for PCT/US03/39942, dated Jul. 12, 2004.
PCT International Search Report for PCT/US2005/017561, dated Aug. 18, 2005.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Uniformity control for low flow process and chamber to... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Uniformity control for low flow process and chamber to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Uniformity control for low flow process and chamber to... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4122260

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.