Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1997-06-24
1999-01-19
Baxter, Janet
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
4302701, 430330, 430919, 4302861, 522 63, 522 99, 522148, G03C 500, C08F 246
Patent
active
058612351
ABSTRACT:
This invention pertains to a curable composition comprising a N-substituted 4-(o-nitrophenyl)dihydropyridine (a compound that generates base under the action of ultraviolet radiation) and a silanol-containing polymer that condenses under the action of the base generated to form a siloxane bond. The compositions of the instant invention cure by exposure to ultraviolet radiation. Cured patterns may be formed from the curable composition by interposing a mask between a film of the said composition and the radiation source during UV exposure, then dissolving and removing the uncured composition to form a pattern, and thereafter heating the residual material. The compositions can be cured by low-strength ultraviolet radiation and produce a highly heat-resistant cured product.
REFERENCES:
patent: 5591783 (1997-01-01), Kobayashi et al.
patent: 5595856 (1997-01-01), Mochizuki et al.
patent: 5616629 (1997-04-01), Nguyen et al.
Jpn. J. Appl. Phys., vol. 32 (1993) pp. 6052-6058, Ito et al. Part I, No. 12B, Dec. 1993.
Harkness Brian R.
Tachikawa Mamoru
Takei Kasumi
Ashton Rosemary
Baxter Janet
Dow Corning Asia Ltd.
Severance Sharon K.
LandOfFree
Ultraviolet-curable composition and method for patterning the cu does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultraviolet-curable composition and method for patterning the cu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultraviolet-curable composition and method for patterning the cu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1245606