Ultrasonic apparatus for forming individual pillowed chips of li

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing

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Details

156220, 1565802, 156 731, 354227, B32B 3118

Patent

active

054338166

ABSTRACT:
An ultrasonic apparatus and method for forming individual pillowed chips of light lock material are provided. An ultrasonic horn and ultrasonic anvil are used to form pillows in a composite web of light lock material. The pillowed web material is then notched and cut to produce individual chips of light lock material. Each individual chip has one pillowed edge and one non-pillowed, notched edge. The pillowing and notching facilitate placement of the individual chips of light lock material into a film cartridge.

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