4. Plastic article or earthenware shaping or treating: apparatus
  5. Means applying electrical or wave energy directly to work
  6. Sonic or supersonic wave energy

Wallace S. Stewart

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Method for cutting and placing individual chips of light lock ma

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Method for ultrasonically splicing web

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Ultrasonic apparatus and method for placing individual chips of

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Ultrasonic apparatus for cutting and placing individual chips of

Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Sonic or supersonic wave energy
Patent

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Ultrasonic apparatus for forming individual pillowed chips of li

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent

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Profile ID: LFUS-PAI-P-157861

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