Ultra-thin Si channel MOSFET using a self-aligned oxygen...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S507000, C257SE27010

Reexamination Certificate

active

07075150

ABSTRACT:
The present invention provides a thin channel MOSFET having low external resistance. In broad terms, a silicon-on-insulator structure comprising a SOI layer located atop a buried insulating layer, said SOI layer having a channel region which is thinned by the presence of an underlying localized oxide region that is located on top of and in contact with said buried insulating layer; and a gate region located atop said SOI layer, wherein said localized oxide region is self-aligned with the gate region. A method for forming the inventive MOSFET is also provided comprising forming a dummy gate region atop a substrate; implanting oxide forming dopant through said dummy gate to create a localized oxide region in a portion of the substrate aligned to the dummy gate region that thins a channel region; forming source/drain extension regions abutting said channel region; and replacing the dummy gate with a gate conductor.

REFERENCES:
patent: 5959331 (1999-09-01), Hsu et al.
patent: 6010921 (2000-01-01), Soutome
patent: 6064092 (2000-05-01), Park
patent: 6437404 (2002-08-01), Xiang et al.
patent: 6479866 (2002-11-01), Xiang
patent: 6531741 (2003-03-01), Hargrove et al.

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