Ultra thin bumped wafer with under-film

Details Ultra thin bumped wafer with under-film Ultra thin bumped wafer with under-film

2007-05-07

2010-11-23

Cao, Phat X (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S459000, C257SE21088

Reexamination Certificate

active

07838391

ABSTRACT:
A semiconductor device begins with a wafer having a plurality of bumps formed on a surface of the wafer. An under-film layer is formed over the wafer to completely cover all portions of the bumps with the under-film layer. An adhesive layer is formed over the under-film layer. A support layer is attached over the adhesive layer. A back surface of the wafer undergoes grinding. The support layer provides structural support to the wafer. The support layer is removed to expose the adhesive layer. The adhesive layer is removed to expose the under-film layer. The wafer is singulated into semiconductor die. The semiconductor die is mounted to a substrate by applying force to a back surface of the semiconductor die to press the bumps through under-film layer to contact the substrate while the under-film layer provides an underfill between the semiconductor die and substrate.

REFERENCES:
patent: 5400950 (1995-03-01), Myers et al.
patent: 6620862 (2003-09-01), Ueda et al.
patent: 6787921 (2004-09-01), Huang
patent: 7105424 (2006-09-01), Tsai et al.
patent: 7413927 (2008-08-01), Patwardhan et al.
patent: 2005/0008873 (2005-01-01), Noro et al.
patent: 2005/0142696 (2005-06-01), Tsai
patent: 2005/0142837 (2005-06-01), Tsai et al.

Affiliated with

Also associated with

Rating

Ultra thin bumped wafer with under-film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultra thin bumped wafer with under-film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultra thin bumped wafer with under-film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4251887