4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Junghoon Shin

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Grooving bumped wafer pre-underfill system

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Grooving bumped wafer pre-underfill system

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Ultra thin bumped wafer with under-film

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3250865

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