4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Shaw W. Lee

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Solder ball attachment machine for semiconductor packages

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Ultra thin ball grid array using a flex tape or printed wiring b

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Profile ID: LFUS-PAI-P-578541

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