Ultra-shallow p-type junction having reduced sheet resistance an

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438199, 438228, 438231, 438232, 438301, 438306, 438528, 438918, H01L 21336

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active

060636823

ABSTRACT:
A method of fabricating a transistor is provided. According to the method, a heavy ion is implanted into a silicon substrate so as to amorphize at least a portion of the silicon substrate. The amorphized silicon is substantially free of channels. A dopant is subsequently implanted into the amorphized silicon, and the amorphized silicon substantially contains the implanted dopant. Thereafter, a silicon implanting step is performed to create an excess of vacancies to interstitials within a predetermined range. Enhanced diffusion of the dopant within the predetermined range is mitigated because of the excess of vacancies to interstitials within this predetermined range.

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