UBM for fine pitch solder ball and flip-chip packaging...

Details UBM for fine pitch solder ball and flip-chip packaging... UBM for fine pitch solder ball and flip-chip packaging...

2007-12-18

2007-12-18

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23069, C438S108000, C438S613000

Reexamination Certificate

active

11012294

ABSTRACT:
A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.

REFERENCES:
patent: 5903058 (1999-05-01), Akram
patent: 6341071 (2002-01-01), Johnson et al.
patent: 2002/0070437 (2002-06-01), Herman
patent: 102 08 910 (2003-09-01), None
patent: 102 23 203 (2003-12-01), None
patent: 0 758 145 (1997-02-01), None
patent: 2001-53111 (2001-02-01), None
patent: WO 03/025974 (2003-03-01), None

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