Two step exposure to strengthen structure of polyimide or...

Details Two step exposure to strengthen structure of polyimide or... Two step exposure to strengthen structure of polyimide or...

2005-09-13

2005-09-13

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S725000, C438S746000, C438S780000

Reexamination Certificate

active

06943124

ABSTRACT:
A method is provided for forming features in a polyimide layer that is employed as an insulating layer or buffer layer during the fabrication of semiconductor devices or chip packaging structures. A pattern is formed in a photosensitive layer that has a high film retention after the development step and a crosslinked network that strengthens and stabilizes it for subsequent processing. The process involves exposing a negative tone photosensitive layer with a first exposure dose that is less than the normal dose used to image the material. The exposed layer is developed to provide a scum free substrate. A second exposure dose then strengthens the formed image by crosslinking unreacted components. First and second exposure doses are determined from a plot of film thickness loss vs. exposure energy. The method applies to photosensitive polyimide precursors as well as negative photoresists that are crosslinked by free radical or chemical amplification mechanisms.

REFERENCES:
patent: 4971895 (1990-11-01), Sullivan
patent: 5194365 (1993-03-01), Goodin et al.
patent: 5292614 (1994-03-01), Ochiai et al.
patent: 5360698 (1994-11-01), Hanrahan
patent: 6184151 (2001-02-01), Adair et al.
patent: 6221567 (2001-04-01), Beilin et al.
patent: 6225019 (2001-05-01), Matsuda et al.
patent: 6329306 (2001-12-01), Nakao
patent: 6423477 (2002-07-01), Engelen et al.

Affiliated with

Also associated with

Rating

Two step exposure to strengthen structure of polyimide or... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Two step exposure to strengthen structure of polyimide or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Two step exposure to strengthen structure of polyimide or... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3397793