Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-10-04
2009-06-16
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C156S499000, C156S556000, C257SE21499
Reexamination Certificate
active
07547575
ABSTRACT:
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.
REFERENCES:
patent: 2004/0061346 (2004-04-01), Capewell
patent: 2004/0244915 (2004-12-01), Lam et al.
Lee Teck-Chong
Lin Chian-Chi
Su Kao-Ming
Tong Ho-Ming
Tsai Chia-Jung
Advanced Semiconductor Engineering Inc.
Coleman W. David
Rabin & Berdo P.C.
Swanson Walter H
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