Two-stage die-bonding method for simultaneous die-bonding of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S499000, C156S556000, C257SE21499

Reexamination Certificate

active

07547575

ABSTRACT:
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

REFERENCES:
patent: 2004/0061346 (2004-04-01), Capewell
patent: 2004/0244915 (2004-12-01), Lam et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Two-stage die-bonding method for simultaneous die-bonding of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Two-stage die-bonding method for simultaneous die-bonding of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Two-stage die-bonding method for simultaneous die-bonding of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4090348

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.