Tungsten tunnel-free process

Fishing – trapping – and vermin destroying

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437195, 437228S, 437231, H01L 21283

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active

056984669

ABSTRACT:
A method of forming a tunnel-free tungsten plug is described. Semiconductor device structures are provided in and on a semiconductor substrate. An insulating layer of borophospho-tetraethoxysilane (BP-TEOS) is deposited overlying the semiconductor device structures. Contact openings are etched through the insulating layer to the underlying semiconductor device structures wherein a tunnel opens in the insulating layer between contact openings. The semiconductor substrate is covered with a first barrier metal layer. The semiconductor substrate is coated with a spin-on-glass layer wherein the contact openings and the tunnel are filled with the spin-on-glass. The spin-on-glass is anisotropically etched away whereby the spin-on-glass remains only within the tunnel. The semiconductor substrate is covered with a second barrier metal layer. The contact openings are filled with tungsten which is etched back to form tungsten plugs within the contact openings wherein the filled tunnel provides tunnel-free tungsten plugs in the fabrication of the integrated circuit device.

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Broadbent, E., et al., "High Density High-Reliability Tungsten . . . ", IEEE Trans. Elec. Dev., vol. 35, No. 7, Jul. 1988, pp. 952-956.
"Method of Anchoring Contact or Via Plugs . . . ", IBM Tech. Disc. Bull., vol. 38, No. 6, Jun. 1995, pp. 405-407.

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