Trench scribe line for decreased chip spacing

Details Trench scribe line for decreased chip spacing Trench scribe line for decreased chip spacing

1996-11-21

1999-05-18

Picardat, Kevin

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

438460, H01L21/46

Patent

active

059045485

ABSTRACT:
A method of scribing and separating chips on a semiconductor wafer (21) wherein the wafer (21) is patterned and a pattern of intersecting grooves is etched on a selected surface of the semiconductor wafer (21) in a pattern, preferably in a grid pattern, to define chip areas on that surface. Trenches (27) are then formed in the shape of the pattern and the selected surface is adhered to a tape (29). Light is then passed through the tape (29) and semiconductor wafer (21) from the pattern and a pattern of intersecting saw cuts or grooves (28) aligned with the light passing through the wafer (21) is formed. The saw cuts (28) extend from a surface of the wafer (21) opposing the selected surface and are aligned with the pattern of intersecting trenches (27).

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