Treatment apparatus control method

Details Treatment apparatus control method Treatment apparatus control method

1996-01-19

1997-08-26

Breneman, R. Bruce

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

156345, 427 8, 2041921, 20429807, 20429809, 20429815, 20429831, 20429833, 118723E, 118724, 118728, 438715, C23C 1434, C23C 1600, H01L 21306

Patent

active

056607407

ABSTRACT:
This invention provides a method of controlling a treatment apparatus including a treatment chamber adjustable to a desired reduced-pressure atmosphere, a mounting table arranged in the treatment chamber to mount an object to be treated, a cooling medium container provided in the mounting table, and a cooling medium supply system for supplying a cooling medium to the cooling medium container and discharging the cooling medium from the cooling medium container. The method includes the steps of treating the object to be treated while decreasing the temperature of the object to be treated by cooling the mounting table by using heat transfer from the cooling medium supplied to the cooling medium container by the cooling medium supply system, and heating the vicinity of a very small gap which traps moisture in a member constituting the treatment apparatus, when the internal temperature of the treatment apparatus is to be raised.

REFERENCES:
patent: 4911812 (1990-03-01), Kudo et al.
patent: 4956043 (1990-09-01), Kanemoto et al.
patent: 5078851 (1992-01-01), Nishihata et al.
patent: 5147497 (1992-09-01), Nozawa et al.
patent: 5252134 (1993-10-01), Stauffer
patent: 5290381 (1994-03-01), Nozawa et al.

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