Transistor with improved tip profile and method of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C257S019000, C257S368000, C257SE21223, C257SE21232, C438S187000, C438S733000

Reexamination Certificate

active

07494858

ABSTRACT:
Embodiments are an improved transistor structure and the method of fabricating the structure. In particular, a wet etch of an embodiment forms source and drain regions with an improved tip shape to improve the performance of the transistor by improving control of short channel effects, increasing the saturation current, improving control of the metallurgical gate length, increasing carrier mobility, and decreasing contact resistance at the interface between the source and drain and the silicide.

REFERENCES:
patent: 2005/0009250 (2005-01-01), Wonju et al.
patent: 2005/0285203 (2005-12-01), Fukutome et al.
patent: 2006/0138398 (2006-06-01), Shimamune et al.
patent: 1 538 650 (1979-01-01), None
patent: WO 2005/0141288 (2005-05-01), None
patent: PCT/US2006/025958 (2006-06-01), None
Osamu Tabata, “pH-Controlled TMAH Etchants for Silicon Micromachining,” Transducers '95, EUROSENSORS IX pp. 83-86, Jun. 25-29, 1995.
Tellier, C.R. et al., “Characterization of the Anisotropic Chemical Attack of (HHL) Silicon Plates in a TMAH 25 Weight % Solution: Micromachining and Adequacy of the Dissolution Slowness Surface”, Sensors and Actuators A, Elsevier Sequoia S.A., Lausanne, CH, vol. 105, No. 1, Jun. 15, 2003, pp. 62-75, XP004427479.

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