Transistor with embedded Si/Ge material having reduced...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S300000, C438S301000, C438S429000, C438S430000, C438S700000, C438S702000, C438S703000, C438S689000, C438S042000, C438S043000, C257S019000, C257S622000, C257SE21092, C257SE21102, C257SE21115, C257SE21127, C257SE21131, C257SE21132, C257SE21218, C257SE21385, C257SE21431

Reexamination Certificate

active

08071442

ABSTRACT:
A strain-inducing semiconductor alloy may be formed on the basis of cavities which may have a non-rectangular shape, which may be maintained even during corresponding high temperature treatments by providing an appropriate protection layer, such as a silicon dioxide material. Consequently, a lateral offset of the strain-inducing semiconductor material may be reduced, while nevertheless providing a sufficient thickness of corresponding offset spacers during the cavity etch process, thereby preserving gate electrode integrity. For instance, P-channel transistors may have a silicon/germanium alloy with a hexagonal shape, thereby significantly enhancing the overall strain transfer efficiency.

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