Transfer material for wiring substrate

Details Transfer material for wiring substrate Transfer material for wiring substrate

2005-03-29

2005-03-29

Zarneke, David A. (Department: 2827)

Metal working

Method of mechanical manufacture

Electrical device making

C029S843000, C174S258000, C174S267000, C228S180210, C428S614000

Reexamination Certificate

active

06871396

ABSTRACT:
A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

REFERENCES:
patent: 4244605 (1981-01-01), Deneau
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4797508 (1989-01-01), Chant
patent: 5141790 (1992-08-01), Calhoun et al.
patent: 5407511 (1995-04-01), Nakatani et al.
patent: 5408053 (1995-04-01), Young
patent: 5546375 (1996-08-01), Shimada et al.
patent: 5667884 (1997-09-01), Bolger
patent: 5689879 (1997-11-01), Urasaki et al.
patent: 5699613 (1997-12-01), Chong et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5776662 (1998-07-01), Shirai et al.
patent: 5855716 (1999-01-01), Tonucci et al.
patent: 5951803 (1999-09-01), Johnston
patent: 6000603 (1999-12-01), Koskenmaki et al.
patent: 6060150 (2000-05-01), Nakatani et al.
patent: 6138348 (2000-10-01), Kulesza et al.
patent: 6143116 (2000-11-01), Hayashi et al.
patent: 6195882 (2001-03-01), Tsukamoto et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6359235 (2002-03-01), Hayashi
patent: 6370013 (2002-04-01), Iino et al.
patent: 6373000 (2002-04-01), Nakamura et al.
patent: 6459046 (2002-10-01), Ochi et al.
patent: 1106822 (1961-05-01), None
patent: 0 525 956 (1993-02-01), None
patent: 568 930 (1993-11-01), None
patent: 0 629 110 (1994-12-01), None
patent: 645 950 (1995-03-01), None
patent: 651 602 (1995-05-01), None
patent: 0 960 725 (1999-12-01), None
patent: 1 102 355 (2001-05-01), None
patent: 999183 (1965-07-01), None
patent: 60-55691 (1985-03-01), None
patent: 60-164392 (1985-08-01), None
patent: 6-132667 (1994-05-01), None
patent: 7-142867 (1995-06-01), None
patent: 8-125291 (1996-05-01), None
patent: 8-125308 (1996-05-01), None
patent: 8-288596 (1996-11-01), None
patent: 2587596 (1996-12-01), None
patent: 8-330709 (1996-12-01), None
patent: 2601128 (1997-01-01), None
patent: 2603053 (1997-01-01), None
patent: 9-36551 (1997-02-01), None
patent: 9-51168 (1997-02-01), None
patent: 9-116267 (1997-05-01), None
patent: 9-270584 (1997-10-01), None
patent: 9-326562 (1997-12-01), None
patent: 10-41611 (1998-02-01), None
patent: 10-51139 (1998-02-01), None
patent: 10-84186 (1998-03-01), None
patent: 10-173097 (1998-06-01), None
patent: 10-173316 (1998-06-01), None
patent: 10-190191 (1998-07-01), None
patent: 11-135946 (1999-05-01), None
patent: 11-261219 (1999-09-01), None
patent: 2000-15742 (2000-01-01), None
patent: 2001-210933 (2001-08-01), None
patent: CN220027 (1994-02-01), None
patent: CN340297 (1998-09-01), None
Japanese Office Action mailed on May 20, 2002.
Verification of Translation.

Affiliated with

Also associated with

Rating

Transfer material for wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transfer material for wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transfer material for wiring substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3391997