Transfer apparatus for arraying small conductive bumps on...

Details Transfer apparatus for arraying small conductive bumps on... Transfer apparatus for arraying small conductive bumps on...

2005-05-10

2005-05-10

Edmondson, L. (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S180220, C228S246000

Reexamination Certificate

active

06889886

ABSTRACT:
Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

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English Version of China Patent Publication No. 460355 (publication date: Oct. 21, 2001).

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