4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator
  6. By partial or total immersion of work or applicator into liquid

Akeo Katahira

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Method of arranging microspheres with liquid, microsphere...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Transfer apparatus for arraying small conductive bumps on a...

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate

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Transfer apparatus for arraying small conductive bumps on...

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2837889

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