Top surface roughness reduction of high-k dielectric...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S772000, C438S777000, C438S785000, C438S786000

Reexamination Certificate

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07115530

ABSTRACT:
A system and method for manufacturing semiconductor devices with dielectric layers having a dielectric constant greater than silicon dioxide includes depositing a dielectric layer on a substrate and subjecting the dielectric layer to a plasma to reduce top surface roughness in the dielectric layer.

REFERENCES:
patent: 6391802 (2002-05-01), Delpech et al.
patent: 2004/0127003 (2004-07-01), Chambers
patent: WO 2004021409 (2004-03-01), None

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