Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2008-03-27
2011-12-06
Fulk, Steven (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257SE23011, C438S107000
Reexamination Certificate
active
08072079
ABSTRACT:
A semiconductor package includes a semiconductor die having a contact pad formed over a top surface of the semiconductor die. The semiconductor die may include an optical device. In one embodiment, a second semiconductor die is deposited over the semiconductor die. The package includes an insulating material deposited around a portion of the semiconductor die. In one embodiment, the insulating material includes an organic material. A first through hole via (THV) is formed in the insulating material using a conductive material. The first THV may form a protrusion extending beyond a bottom surface of the semiconductor die opposite the top surface and be connected to a first semiconductor device. A redistribution layer (RDL) may be deposited over the semiconductor die. The RDL forms an electrical connection between the contact pad of the semiconductor die and the first THV.
REFERENCES:
patent: 6693361 (2004-02-01), Siniaguine et al.
patent: 6727116 (2004-04-01), Poo et al.
patent: 2005/0230804 (2005-10-01), Tanida et al.
patent: 2006/0220256 (2006-10-01), Shim et al.
patent: 2007/0216006 (2007-09-01), Park et al.
Camacho Zigmund R.
Do Byung Tai
Pagaila Reza A.
Tay Lionel Chien Hui
Atkins Robert D.
Fulk Steven
Patent Law Group
STATS ChipPAC Ltd.
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