Through-chip via interconnects for stacked integrated...

Details Through-chip via interconnects for stacked integrated... Through-chip via interconnects for stacked integrated...

2011-03-22

2011-03-22

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S774000

Reexamination Certificate

active

07911066

ABSTRACT:
A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.

REFERENCES:
patent: 5640051 (1997-06-01), Tomura et al.
patent: 6222276 (2001-04-01), Bertin et al.
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 2001/0001292 (2001-05-01), Bertin et al.

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