Three dimensional semiconductor package having flexible appendag

Details Three dimensional semiconductor package having flexible appendag Three dimensional semiconductor package having flexible appendag

1996-04-23

1998-08-04

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257668, 257678, 361749, 361784, 361792, 361790, H01L 23495, H01L 2334, H01L 2302

Patent

active

057898154

ABSTRACT:
A three dimensional packaging approach reduces the overall footprint for interconnecting multiple semiconductor die. An three-dimensional folded module (10) produces a final package having a footprint size reduced by an approximate factor of four when compared to conventional electronic packaging. The module has a protective covering such as a cap (62) or a sealant (64) as a moisture barrier. Thus, high integration using flexible appendages (15, 25, 35, and 45) attached to a rigid substrate (12) and singularly folded above the substrate (12) results in both a small footprint package and also a light package. A reel-to-reel flex tape (56) assembly provides pre-tested flex boards (16, 26, 36, and 46) resulting in a cost-effective manufacturable package for semiconductor components.

REFERENCES:
patent: 5072283 (1991-12-01), Bolger
patent: 5220198 (1993-06-01), Tsui
patent: 5224023 (1993-06-01), Smith et al.
patent: 5285107 (1994-02-01), Kazami et al.
patent: 5363275 (1994-11-01), Frankeny et al.
patent: 5382829 (1995-01-01), Inoue
patent: 5406027 (1995-04-01), Matsumoto et al.
patent: 5448511 (1995-09-01), Paurus et al.

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