4. Metal fusion bonding
  5. Process
  6. Plural joints

David A. Jandzinski

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Electronic component and method of packaging

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Fluxless flip-chip bond and a method for making

Metal fusion bonding – Process – Plural joints
Patent

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Smartcard and method of making

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Three dimensional semiconductor package having flexible appendag

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Profile ID: LFUS-PAI-P-157029

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