Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-03-01
2005-03-01
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S311000, C430S313000, C430S315000, C430S322000, C430S324000
Reexamination Certificate
active
06861205
ABSTRACT:
A method of forming complex three-dimensional microstructures wherein an external stimulus is applied to a first layer of a photosensitive material, thereby creating voids in the first layer, and any material present in those voids is removed. A sacrificial material is then provided within at least a portion of the voids. This sacrificial layer fills the voids, either in whole or in part, and enables a second layer of photosensitive material to be stacked upon the first, while still preserving the pattern formed in the first layer. Once the sacrificial layer has been applied, a second layer of photosensitive material may then be stacked onto the first. Successive layers of photosensitive material and sacrificial material may be added until a final, complex three-dimensional structure is created. The sacrificial material may then be removed with a solvent such as carbon dioxide.
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Bowman Lawrence E.
Dunham Glen C.
Barreca Nicole
Battelle (Memorial Institute)
Huff Mark F.
McKinley, Jr. Douglas G.
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