Three-dimensional integrated circuits with protection layers

Details Three-dimensional integrated circuits with protection layers Three-dimensional integrated circuits with protection layers

2006-12-19

2010-10-12

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23010, C257SE23023, C257SE23145, C438S108000, C438S109000, C438S456000

Reexamination Certificate

active

07812459

ABSTRACT:
A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and a protection layer having a vertical portion on a sidewall of the second die, and a horizontal portion extending over the first die.

REFERENCES:
patent: 5394303 (1995-02-01), Yamaji
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6268660 (2001-07-01), Dhong et al.
patent: 6501663 (2002-12-01), Pan
patent: 6747348 (2004-06-01), Jeung et al.
patent: 6750539 (2004-06-01), Haba et al.
patent: 6756252 (2004-06-01), Nakanishi
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 6908856 (2005-06-01), Beyne et al.
patent: 7595222 (2009-09-01), Shimoishizaka et al.
patent: 2004/0000725 (2004-01-01), Lee
patent: 2004/0235266 (2004-11-01), Tong
patent: 2005/0146005 (2005-07-01), Shimoishizaka et al.
patent: 2005/0161795 (2005-07-01), Tong et al.
patent: 2008/0111230 (2008-05-01), Kim et al.
patent: 2008/0142990 (2008-06-01), Yu et al.
patent: 2008/0224322 (2008-09-01), Shinogi
Fukushima, et al., “New Three-Dimensional Integration Technology Using Self-Assembly Technique,” 2005 IEEE, 4 pages.

Affiliated with

Also associated with

Rating

Three-dimensional integrated circuits with protection layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional integrated circuits with protection layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional integrated circuits with protection layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4173671