4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Staktek Group L.P.

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Chip scale stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Chip stack with differing chip package types

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Clock driver with instantaneously selectable phase and...

Multiplex communications – Communication techniques for information carried in plural... – Combining or distributing information via time channels
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Contact member stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Contact member stacking system and method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2037212

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